Improving Reliability of Tungsten Plug Via on an Integrated Circuitry

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The failure of an electronic circuitry with Aluminum metal process due to electromigration degradation has been a continuous process of research and development in semiconductor industry. With the advent of Internet of Things (IoT) revolution in global semiconductor industry, there is an expected huge demand for analog ICs for healthcare, automotive and other consumer electronic applications. Analog ICs make use of Aluminum metal process as most of the analog applications do not need a state-of-the-art technology. Aluminum is not only cost effective in use but also easy to use in processing as compared to copper. However, Aluminum metal process is prone to electromigration failures. Hence, Electronic chips that make use of Aluminum metal process have to undergo rigorous tests for reliability related failures. When wafer yield becomes low due to electromigration related failures, it results into a huge loss for the semiconductor foundries because of the capital intensive nature of this business. Hence, Semiconductor Industry Professional should be equipped with detail process steps in order to improve the process yield including statistical analysis with Design of Experiments (DoE).