Hybrid Assemblies and Multichip Modules

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Providing a description of design considerations from the user's viewpoint, this detailed reference discusses the materials used in manufacturing hybrid assemblies and multichip modules - illustrating how these products are created for a wide range of applications., Examining the current state of hybrid assembly technology, Hybrid Assemblies and Multichip Modules: provides a thorough overview of substrate materials and metals used for conductors, addressing multilayer materials and overglazes, explicates design considerations such as circuit layout, component placement, thermal management and interface problems, clarifies the manufacturing techniques used for multi-layer thick-film circuits and multilayer substrates, and explains soldering and other attachment methods for discrete components., Focusing primarily on electronic assemblies that use ceramic substrates, Hybrid Assemblies and Multichip Modules should serve as a comprehensive resource for manufacturing, electrical and electronics, and automotive engineers, manufacturing managers, hybrid assembly designers, hybrid assembly users, printed circuit designers, fabricators and users, and graduate-level students in manufacturing engineering and electronic packaging courses.