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- International Symposium on Electronic Materials and Packaging (Emap2000): November 30-December 2, 2000, Hong Kong
International Symposium on Electronic Materials and Packaging (Emap2000): November 30-December 2, 2000, Hong Kong
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Topics covered by this title include: flip chip running, solder join reliability, emerging technologies, solder materials, delimitation, polymers for packaging, design and process, modelling and testing, material characterization, and package reliability.
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