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- Tribology In Chemical-Mechanical Planarization
Tribology In Chemical-Mechanical Planarization
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Tribology in Chemical-Mechanical Planarization presents a detailed account of the CMP process in a language that is suitable for tribology professionals as well as chemists, materials scientists, physicists, and other applied scientists and engineers in fields of semiconductors and microelectronics. Expanding upon the science and technology of tribology to design, optimize, and improve the consistency of manufacturing processes and other material applications, Tribology in Chemical-Mechanical Planarization provides scientists and engineers with clear foresight to the future of this technology.
Lieferbar in ca. 10-20 Arbeitstagen